Apparatus and method for manufacturing an anti-counterfeit three-dimensional article

ABSTRACT

An additively manufactured three-dimensional article includes layers successively built up from a metal powder by an additive manufacturing process by scanning a selected portion of the metal powder with electromagnetic radiation, and an anti-counterfeiting mark formed in at least one layer of the layers during the additive manufacturing process.

PRIORITY

This application is a divisional of U.S. Ser. No. 14/613,504 filed onFeb. 4, 2015.

FIELD

The present disclosure is generally related to additive manufacturingand, more particularly, to three-dimensional articles havinganti-counterfeit authentication and apparatuses for additivelymanufacturing the same.

BACKGROUND

Additive manufacturing, often referred to as 3D printing, builds asolid, often geometrically complex object from a series of layers, eachone “printed” on top of the previous one. In contrast to moreconventional, “subtractive” processes, such as CNC milling or machining,additive manufacturing enables fast, flexible and cost-efficientproduction of three-dimensional objects from three-dimensional computeraided design (3D CAD) data.

Recently, additive manufacturing has become an attractive solution forthe manufacturing of metallic functional components. Additivemanufacturing methods use a powder material as a base material. Themanufactured component is generated directly from a powder bed. Additivemanufacturing techniques allow for the manufacture of high performanceand complex shaped parts due to the capability to generate verysophisticated designs directly from the powder bed.

However, as additive manufacturing technology improves, it provides aperfect tool for counterfeiters. Not only is it possible for counterfeitproducts to be manufactured and sold on the consumer market; unknown tothe original equipment manufacturer (OEM), counterfeit components mayalso make their way into the OEM supply chain of genuine products.

Traditional anti-counterfeiting labeling techniques are unsuitable formetal components. This is because metal parts have a higher meltingtemperature than any ink or polymer that would be used to label thepart. Other anti-counterfeiting labeling or marker techniques, such asembedded nanoparticles, stamping, coatings, adhesives in drilled holes,or DNA markings, increase the cost and process time of manufacturing thepart.

Accordingly, those skilled in the art continue with research anddevelopment efforts in the field of additive manufacturing.

SUMMARY

In an embodiment, the disclosed additively manufacturedthree-dimensional article includes layers successively built up from ametal powder by an additive manufacturing process by scanning a selectedportion of the metal powder with electromagnetic radiation, and ananti-counterfeiting mark formed in at least one layer of the layersduring the additive manufacturing process.

In another embodiment, the disclosed additively manufacturedthree-dimensional article includes layers successively built up from ametal powder by an additive manufacturing process, defined by at leastone process parameter, by scanning a selected portion of the metalpowder with electromagnetic radiation to establish an articlemicrostructure of the article following solidification of the selectedportion of the metal powder. The additively manufacturedthree-dimensional article further includes an anti-counterfeiting markformed in at least one layer of the layers during the additivemanufacturing process, defined by a modification of the at least oneprocess parameter, by scanning another selected portion of the metalpowder with the electromagnetic radiation to establish ananti-counterfeiting mark microstructure of the anti-counterfeiting markfollowing solidification of the another selected portion of the metalpowder. The article microstructure and the anti-counterfeiting markmicrostructure are different.

In yet another embodiment, the disclosed additive manufacturingapparatus includes an electromagnetic radiation source configured toemit electromagnetic radiation, an imaging system, a processor connectedto the electromagnetic radiation source and the imaging system, and anon-transitory computer-readable storage medium containing instructions,that when executed by the processor (1) generates a three-dimensionalmodel representing a three-dimensional article, (2) generates ananti-counterfeiting image, (3) combines the anti-counterfeiting imagewith the three-dimensional model, (4) successively builds up the articlefrom a metal powder by an additive manufacturing process by scanning themetal powder with the electromagnetic radiation based on thethree-dimensional model, (5) forms an anti-counterfeiting mark in thearticle during the additive manufacturing process by scanning a selectedportion of the metal powder with the electromagnetic radiation based onthe anti-counterfeiting image, and (6) determines whether the articleincludes the anti-counterfeiting mark by examining the article with theimaging system during the additive manufacturing process.

Other embodiments of the disclosed article, apparatuses, and methodswill become apparent from the following detailed description, theaccompanying drawings and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of one embodiment of the disclosed additivemanufacturing environment;

FIG. 2 is a schematic perspective view of the disclosed additivemanufacturing apparatus of FIG. 1;

FIG. 3 is a schematic side elevation view of one embodiment of anelectromagnetic radiation source and a build platform of the additivemanufacturing apparatus of FIG. 1;

FIG. 4 is a schematic side elevation view of the electromagneticradiation source and the build platform of the additive manufacturingapparatus of FIG. 3 illustrating formation of a first layer of anadditively manufactured three-dimensional article;

FIG. 5 is a schematic side elevation view of the electromagneticradiation source and the build platform of the additive manufacturingapparatus of FIG. 4;

FIG. 6 is a schematic side elevation view of the electromagneticradiation source and the build platform of the additive manufacturingapparatus of FIG. 5 illustrating formation of a second layer of theadditively manufactured three-dimensional article;

FIG. 7 is a schematic perspective view of one embodiment of thedisclosed additively manufactured three-dimensional article of FIG. 1;

FIG. 8 is a schematic top plan view of one embodiment of the disclosedadditively manufactured three-dimensional article of FIG. 1;

FIG. 9A is a first portion of a flow diagram of one embodiment of thedisclosed method for additively manufacturing a three-dimensionalarticle;

FIG. 9B is a second portion of the flow diagram of one embodiment of thedisclosed method for additively manufacturing a three-dimensionalarticle;

FIG. 10 is a schematic block diagram of one embodiment of a dataprocessing system;

FIG. 11 is a block diagram of aircraft production and servicemethodology; and

FIG. 12 is a schematic illustration of an aircraft.

DETAILED DESCRIPTION

The following detailed description refers to the accompanying drawings,which illustrate specific embodiments of the disclosure. Otherembodiments having different structures and operations do not departfrom the scope of the present disclosure. Like reference numerals mayrefer to the same element or component in the different drawings.

FIG. 1 illustrates one embodiment of additive manufacturing environment100. Three-dimensional article (herein generally designated “article”200) may be manufactured by additive manufacturing apparatus (hereingenerally designated “apparatus” 102).

As used herein, the term “article” refers to any three-dimensionalobject, part, component, product or the like having almost any shape orgeometry and produced by an additive manufacturing process. An additivemanufacturing process includes any process or operation formanufacturing a three-dimensional article in which successive layers ofa base material are laid down, for example, under computer control.

Apparatus 102 may include electromagnetic radiation source 108. Article200 may be manufactured by successive addition of powder stratums 104 ofa predetermined thickness t1, area a, and/or contour c, which are meltedby electromagnetic radiation 106 of electromagnetic radiation source108.

Powder stratums 104 may include a base material. As one example, thebase material of powder stratums 104 may include metal powder 116. Metalpowder 116 includes any metal or metal alloy in powder form. Thus, asone example, apparatus 102 may be used to manufacture article 200 madeof metal. As one example, metal powder 116 may include the same materialas article 200. For instance, metal powder 116 may be a pure materialhaving no additional filler materials. As another example, metal powder116 may include additional materials different than the material ofarticle 200. For instance, metal powder 116 may include additionalfiller materials.

Electromagnetic radiation source 108 may generate and/or emitelectromagnetic radiation 106 capable of irradiating metal powder 116 ofpowder stratum 104 to form a solid homogeneous mass of material (e.g.,article 200). Electromagnetic radiation 106 may take the form of aconcentrated beam of electromagnetic radiation or energy. Apparatus 102utilizes electromagnetic radiation source 108, for example, undercomputer control, to form article 200 by selectively melting metalpowder 116 layer-by-layer into a solid, homogeneous metal mass withelectromagnetic radiation 106.

As one general, non-limiting example, electromagnetic radiation source108 may include an electron beam generator (e.g., electron beam melting(“EBM”)). The electron beam generator generates and/or emits an electronbeam (e.g., electromagnetic radiation 106) capable of selectivelymelting metal powder 116 to form article 200.

As another general, non-limiting example, electromagnetic radiationsource 108 may include a laser beam generator (e.g., selective lasermelting (“SLM”)). The laser beam generator generates and/or emits alaser beam (e.g., electromagnetic radiation 106) capable of selectivelymelting metal powder 116 to form article 200.

The electron beam generator and/or the laser beam generator used in theadditive manufacturing process may produce (e.g., generate and/or emit)a sufficient amount of radiation energy (e.g., electron beam or laserbeam, respectively) to promote melting of metal powder 116.Advantageously, article 200 produced by the additive manufacturingprocess (e.g., electron beam melting or laser melting techniques) isfully dense, void-free, and extremely strong.

Referring to FIG. 1, and with reference to FIG. 2, electromagneticradiation source 108 may be movable relative to article 200 (or buildplatform 130) during the additive manufacturing process. Movement ofelectromagnetic radiation source 108 relative to article 200 mayappropriately position electromagnetic radiation source 108 and, thus,electromagnetic radiation 106, for selective melting of metal powder 116(e.g., at least a portion of powder stratum 104).

As one example, electromagnetic radiation source 108 may be linearlymovable relative to article 200 (or build platform 130). For instance,electromagnetic radiation source 108 may be linearly moved along anX-axis (e.g., in the direction of arrow 122), linearly moved along aY-axis (e.g., in the direction of arrow 124), linearly moved along aZ-axis (e.g., in the direction of arrow 126) or a combination thereof.

As another example, electromagnetic radiation source 108 may berotatably movable relative to article 200 (or build platform 130). Forinstance, electromagnetic radiation source 108 may be rotatably movedabout the Z-axis (e.g., in the direction of arrow 128).

As another example, electromagnetic radiation source 108 may benon-linearly moveable relative to article 200 (or build platform 130).For instance, electromagnetic radiation source 108 may be freely movedrelative to article 200, for example, to form complex shapes.

Apparatus 102 may further include electromagnetic radiation sourcedriving mechanism 118. Electromagnetic radiation source drivingmechanism 118 may be operatively coupled to electromagnetic radiationsource 108. As general, non-limiting examples, electromagnetic radiationsource driving mechanism 118 may include any suitable mechanical,electro-mechanical, hydraulic or pneumatic mechanism configured to drivemotion (e.g., linear, rotatable, and/or non-linear) of electromagneticradiation source 108 relative to article 200. As other general,non-limiting examples, electromagnetic radiation source drivingmechanism 118 may include robotic mechanisms, end-effectors, autonomousvehicles and/or other related technologies configured to drive motion(e.g., linear, rotatable, and/or non-linear) of electromagneticradiation source 108 relative to article 200.

Referring to FIG. 1, and with reference to FIG. 2, electromagneticradiation 106 may be steered relative to article 200. Steeringelectromagnetic radiation 106 may appropriately control a meltingprofile of metal powder 116 during selective melting of metal powder 116(e.g., at least a portion of powder stratum 104).

As one example, electromagnetic radiation 106 may be linearly steerablerelative to article 200 (or build platform 130). For instance,electromagnetic radiation 106 may be linearly steered along the X-axis(e.g., in the direction of arrow 122), linearly steered along the Y-axis(e.g., in the direction of arrow 124), linearly steered along the Z-axis(e.g., in the direction of arrow 126) or a combination thereof.

As another example, electromagnetic radiation 106 may be non-linearlysteerable relative to article 200. For instance, electromagneticradiation 106 may be freely steered relative to article 200, forexample, to form complex shapes.

Apparatus 102 may further include electromagnetic radiation steeringmechanism 120. Electromagnetic radiation steering mechanism 120 may beoperatively coupled to electromagnetic radiation 106. As one general,non-limiting example, electromagnetic radiation steering mechanism 120may include an electromagnetic steering mechanism configured to controlthe location, position and/or orientation of the electron beam orotherwise steer the electron beam. As another general, non-limitingexample, electromagnetic radiation steering mechanism 120 may includemechanical galvo mirrors configured to control the location, positionand/or orientation of the laser beam or otherwise steer the laser beam.As other general, non-limiting examples, electromagnetic radiationsteering mechanism 120 may include robotic mechanisms, end-effectors,autonomous vehicles and/or other related technologies configured tocontrol the location, position and/or orientation of electromagneticradiation 106 or otherwise steer electromagnetic radiation 106.

Referring to FIG. 1, and with reference to FIG. 2, apparatus 102 mayfurther include build platform 130. Build platform 130 provides a buildsurface to support metal powder 116 and article 200, additivelymanufactured therefrom. Movement of build platform 130 relative toelectromagnetic radiation source 108 may appropriately position powderstratum 104 for selective melting of metal powder 116 (e.g., at least aportion of powder stratum 104). Movement of build platform 130 relativeto electromagnetic radiation source 108 may facilitate successivelayering of metal powder 116 (e.g., additional powder stratums 104) uponbuild platform 130 and/or article 200.

As one example, build platform 130 may be linearly movable relative toelectromagnetic radiation source 108. For instance, build platform 130may be linearly (e.g., vertically) moved along the Z-axis (e.g., in thedirection of arrow 134).

As another example, build platform 130 may be rotatably movable relativeto electromagnetic radiation source 108. For instance, build platform130 may be rotatably moved about the Z-axis (e.g., in the direction ofarrow 136).

Apparatus 102 may further include build platform driving mechanism 132.Build platform driving mechanism 132 may be operatively coupled to buildplatform 130. Build platform driving mechanism 132 may include anysuitable mechanical, electro-mechanical, hydraulic or pneumaticmechanism configured to drive motion (e.g., linear and/or rotatable) ofbuild platform 130 relative to electromagnetic radiation source 108.

Referring to FIGS. 3 and 4, as one example, during the additivemanufacturing operation, build platform 130 may be positioned verticaldistance d1 away from electromechanical radiation source 108. Firstpowder stratum 104 a of metal powder 116 may be distributed upon buildplatform 130, as illustrated in FIG. 3. Electromagnetic radiation 106may melt a selected portion of metal powder 116 of first powder stratum104 a to form first layer 202 a of article 200, as illustrated in FIG.4.

Referring to FIGS. 5 and 6, build platform 130 may then vertically moveaway from electromagnetic radiation source 108 to vertical distance d2.Second powder stratum 104 b of metal powder 116 may be distributed uponbuild platform 130 and/or upon at least a portion of article 200, asillustrated in FIG. 5. Electromagnetic radiation 106 may melt a selectedportion of metal powder 116 of second powder stratum 104 b to formsecond layer 202 b of article 200.

Unless otherwise indicated, the terms “first,” “second,” etc. are usedherein merely as labels, and are not intended to impose ordinal,positional, or hierarchical requirements on the items to which theseterms refer. Moreover, reference to a numbered item (e.g., a “second”item) does not require or preclude the existence of a lower-numbereditem (e.g., a “first” item) and/or a higher-numbered item (e.g., a“third” item).

Each successive (e.g., additional) layer 202 is formed upon a precedinglayer 202 to form a solid homogeneous mass in order to form article 200.Accordingly, those skilled in the art will recognize that the dashedline separating first layer 202 a and second layer 202 b in FIG. 6 issolely for the purpose of illustrating the disclosed embodiments of theadditive manufacturing process and does not imply any separation (e.g.,physical or structural separation) between layers 202 forming article200.

Those skilled in the art will recognize that as build platform 130 movesvertically away from electromagnetic radiation source 108, thedifference between vertical distance d2 and vertical distance d1 maydefines the thickness t1 of each powder stratum 104 and, thus, athickness of each layer 202. The thickness t1 of each powder stratum 104and, thus, the thickness of each layer 202 may also be defined byvarious other factors depending upon, for example, the method fordispensing metal powder 116 as powder stratum 104 upon build platform130 and/or article 200, the relative motion of build platform 130 and/orelectromagnetic energy source 108, the particular type ofelectromagnetic radiation 106, the movement of electromagnetic radiation106, process parameters 112 and the like.

Referring to FIG. 1, and with reference to FIG. 2, apparatus 102 mayfurther include powder-containment compartment 138. Powder-containmentcompartment 138 is configured to contain metal powder 116.Powder-containment compartment 138 defines at least a portion ofpowder-bed volume 140. Similarly, build platform 130 at least partiallydelimits powder-bed volume 140. As one example, metal powder 116 iscontained by powder-containment compartment 138 when deposited uponbuild platform 130.

Build platform 130 may be linearly movable (e.g., in the direction ofarrow 134) within powder-containment compartment 138. Linearly (e.g.,vertically) moving build platform 130 within powder-containmentcompartment 138 varies powder-bed volume 140. Thus, powder-bed volume140 is variable based on the position of build platform 130. As oneexample, as build platform 130 moves away from electromagnetic radiationsource 108, powder-bed volume 140 increases, thereby facilitatingdistribution of additional metal powder 116 to form additional powderstratums 104 and formation of additional layers 202 of article 200.

Referring to FIG. 1, apparatus 102 may further include powder dispenser142. Powder dispenser 142 may be configured to deposit metal powder 116into powder-containment compartment 138, onto build platform 130 and/oronto article 200 in successive layers to form powder stratums 104 (e.g.,first powder stratum 104 a, second powder stratum 104 b, etc.) (FIGS.3-6). As one example, powder dispenser 142 deposits metal powder 116 aspowder stratum 104 having a uniform thickness on build platform 130and/or on a previously processed powder stratum 104 (e.g., precedinglayer 202 of article 200). Generally, powder dispenser 142 may includeany mechanism, device or system configured to receive metal powder 116from a powder source and feed metal powder 116 from the powder source tobuild platform 130.

Referring to FIG. 1, and with reference to FIG. 2, apparatus 102 mayfurther include control unit 144. Control unit 144 may be incommunication with and configured to control electromagnetic radiationsource 108, electromagnetic radiation source driving mechanism 118,electromagnetic radiation steering mechanism 120, build platform drivingmechanism 132 and/or powder dispenser 142.

Referring to FIG. 7, and with reference to FIG. 1, article 200 includesa solid, homogeneous mass formed from the base material (e.g., metalpowder 116). Article 200 is grown layer by layer by irradiating (e.g.,melting and cooling) successive powder stratums 104 (FIG. 1) of metalpowder 116. Thus, embodiments of the additive manufacturing processdisclosed herein may be defined as essentially a melting andsolidification process of the base material (e.g., metal powder 116) toform article 200.

Generally, article 200 is formed by a plurality of successive layers202. As one example, and as best illustrated in FIG. 7, article 200 mayinclude first (e.g., base) layer 202 a, one or more interior layers 202c (e.g., second layer 202 b and any additional layers 202 disposedbetween first layer 202 b and topmost layer 202 n) and topmost (e.g.,final) layer 202 n. Each successive (e.g., additional) layer 202 may beformed upon a preceding layer 202 (e.g., second layer 202 b may beformed upon first layer 202 a, third layer may be formed upon secondlayer 202 b, etc.) to form the solid, homogeneous article 200. The totalnumber of layers 202 built up to form article 200 may vary dependingupon, for example, the shape, size and/or geometry of article 200,without limitation. Accordingly, those skilled in the art will recognizethat the dashed lines separating layers 202 in FIG. 7 is solely for thepurpose of illustrating the disclosed embodiments of the additivemanufacturing process used to form article 200 and does not imply anyseparation (e.g., physical or structural separation) between layers 202forming article 200.

Referring to FIG. 7, and with reference to FIG. 1, article 200 mayinclude anti-counterfeiting mark 206. Anti-counterfeiting mark 206 maybe formed in article 200 during creation or formation of article 200 byembodiments of the additive manufacturing process (e.g., in situ). Asone example, and as best illustrated in FIG. 7, anti-counterfeiting mark206 may be formed in at least a portion of topmost layer 202 n, forexample, proximate (e.g., at or near) exterior surface 210 of article200. For instance, anti-counterfeiting mark 206 may be formed inexterior surface 210 and extend at least partially through the thicknessof article 200 (e.g., topmost layer 202 n). For another instance,anti-counterfeiting mark 206 may be formed in interior layer 202 cdirectly preceding topmost layer 202 n and extend at least partiallythrough the thickness of article 200 and topmost layer 202 n may be aprotective (e.g., very thin) layer, through which anti-counterfeitingmark 206 is identifiable. In either instance, article 200 may include aprotective (and e.g., substantially clear) coating (not shown) coveringexterior surface 210 and/or anti-counterfeiting mark 206, through whichanti-counterfeiting mark 206 is identifiable. In such an example,anti-counterfeiting mark 206 may be identifiable through examination,for example, through microscopy, of an exterior (e.g., exterior surface210) of article 200 (e.g., viewable from outside of article 200) inorder to authentic article 200.

As another example (not shown), anti-counterfeiting mark 206 may beformed in at least a portion of one or more interior layers 202 c ofarticle 200. For instance, anti-counterfeiting mark 206 may be formedwithin and extend at least partially through the thickness of article200. In such an example, anti-counterfeiting mark 206 may beidentifiable through examination, for example, through microscopy, of aninterior of article 200 (e.g., not viewable from outside of article 200)in order to authentic article 200.

Referring to FIG. 1, and with reference to FIG. 7, article 200 includesan overall microstructure 204, each layer 202 includes layermicrostructure 212 and anti-counterfeiting mark 206 includesanti-counterfeiting mark microstructure 214. Microstructure 204 ofarticle 200, layer microstructure 212 and/or anti-counterfeiting markmicrostructure 214 may be formed (e.g., created), for example, by themelting profile of metal powder 116 as the selected portion of eachpowder stratum 104 melts, the directional solidification of the meltedmetal powder 116 as the selected portion of each powder stratum 104cools to form layer 202 and/or other appropriate factors, for example,as defined by process parameters 112.

As used herein, “microstructure” generally refers to the fine structureof a material, usually visible through a microscope (rather than byeye), and sometimes after some form of surface preparation such as thepolishing or etching of metal or metal alloys.

Thus, microstructure 204 of article 200 may be the physical structure,physical features, grain structure and/or orientation (e.g., of thesolidified metal powder 116 forming article 200) and/or variations orchanges therein of article 200, for example, as seen through microscopyand/or examined by metallography. Layer microstructure 212 may be thephysical structure, physical features, grain structure and/ororientation (e.g., of the solidified metal powder 116 forming layer 202)and/or variations or changes therein of layer 202, for example, as seenthrough microscopy and/or examined by metallography. Anti-counterfeitingmark microstructure 214 may be the physical structure, physicalfeatures, grain structure and/or orientation (e.g., of the solidifiedmetal powder 116 forming anti-counterfeiting mark 206) and/or variationsor changes therein of anti-counterfeiting mark 206, for example, as seenthrough microscopy and/or examined by metallography.

Anti-counterfeiting mark 206 is formed or defined by variations inmicrostructure. As one example, anti-counterfeiting mark 206 may beformed by varying microstructure 204 of at least a portion of article200. As another example, anti-counterfeiting mark 206 may be formed byvarying layer microstructure 212 of at least a portion of at least onelayer 202 (e.g., interior layer 202 c or topmost layer 202 n) of article200.

Microstructure 204 of article 200 (or layer microstructure 212 of eachlayer 202 of article 200) may be controlled by setting and/ormanipulating various process parameters 112. By modifying and/ormanipulating process parameters 112 during formation of article 200,article 200 may include a uniform or homogeneous microstructure 204(e.g., each layer 202 of article 200 includes the same layermicrostructure 212) or a non-uniform or inhomogeneous microstructure 204(e.g., one or more layers 202 of article 200 includes a different layermicrostructure 212). By modifying and/or manipulating process parameters112 during formation of article 200, at least a portion of at least onelayer 202 (e.g., interior layer 202 c or topmost layer 202 n) of article200 may include anti-counterfeiting mark microstructure 214 that isdifferent from layer microstructure 212 of layer 202 (or overallmicrostructure 204 of article 200).

For example, process parameters 112 may include, but are not limited to,melting speed 164 of metal powder 116, power level 166 (e.g., energyoutput) of electromagnetic radiation 106, direction 168 ofelectromagnetic radiation 106, melting temperature 170 of metal powder116, hold temperature 172 of the melted metal powder 116, hold time 174of the melted metal powder 116, cool down time 176 to solidify metalpowder 116, scanning velocity 178 of electromagnetic radiation source108 (e.g., the speed at which electromagnetic radiation source 108travels relative to powder stratum 104) and/or focal offset value 182(e.g., an adjustment from the known convergence of focal distance foroptimized spot density).

As one example, anti-counterfeiting mark 206 and, thus,anti-counterfeiting mark microstructure 214 may extend through part orall of the thickness t2 (FIG. 7) of topmost layer 202 n of article 200.As another example, anti-counterfeiting mark 206, and thus,anti-counterfeiting mark microstructure 214 may extend through part orall of the thickness of one or more interior layers 202 c. As yetanother example, anti-counterfeiting mark 206, and thus,anti-counterfeiting mark microstructure 214 may extend through thethickness t2 of topmost layer 202 n and part or all of the thickness ofone or more interior layers 202 c directly adjacent to topmost layer 202n (e.g., through a part or all of the through-thickness of article 202).

Those skilled in the art will recognize that the thickness of any layer202 (e.g., the thickness t2 of topmost layer 202 n) may be defined bythe thickness of a corresponding powder stratum 104 (e.g., the thicknesst1 of topmost powder stratum 104 n). As one example, anti-counterfeitingmark 206 and, thus, anti-counterfeiting mark microstructure 214, mayrange from a minimum of one layer thickness (e.g., advantageously 0.010inch (0.254 mm)) to a maximum of the through-thickness of article 200.As another example, anti-counterfeiting mark 206 and, thus,anti-counterfeiting mark microstructure 214, may range from a minimum ofless than one layer thickness to a maximum of one layer thickness.

The thickness of a given layer 202 and the extent through whichanti-counterfeiting mark 206 and, thus, anti-counterfeiting markmicrostructure 214 extends through a given layer 202 is not limited tothese thickness ranges. For example, the thickness of a given layer 202may only be limited by the thickness of a corresponding powder stratum104, the particular additive manufacturing apparatus 102 (e.g., the typeof electromagnetic radiation source 108 and/or electromagnetic radiation106) used for the additive manufacturing process and/or processparameters 112 of the additive manufacturing process. Thus, thethickness of any given layer 202 could be much thinner or much thickerthan the example thickness range.

Article process parameters 156 may be utilized to form all layers 202 ofarticle 200 (e.g., first layer 202 a through topmost layer 202 n) suchthat article 200 includes the overall article microstructure 204 (e.g.,defined by the combination of layer microstructures 212). Articleprocess parameters 156 may be the same for each layer 202 or may bevaried for one or more layers 202.

For example, article process parameters 156 may be one example ofprocess parameters 112 and may include, but are not limited to, meltingspeed 164 of metal powder 116 of each successive powder stratum 104,power level 166 (e.g., energy output) of electromagnetic radiation 106applied to metal powder 116 of each successive powder stratum 104,direction 168 of electromagnetic radiation 106 applied to metal powder116 of each successive powder stratum 104, melting temperature 170 ofmetal powder 116 of each successive powder stratum 104, hold temperature172 of the melted metal powder 116 of each successive powder stratum104, hold time 174 of the melted metal powder 116 of each successivepowder stratum 104, cool down time 176 to solidify metal powder 116 ofeach successive powder stratum 104, scanning speed 178 ofelectromagnetic radiation 106 of each successive powder stratum 104and/or focal offset value 182.

Anti-counterfeiting mark process parameters 162 may be utilized to formanti-counterfeiting mark 206 in one or more layers 202 (e.g., interiorlayer 202 c, topmost layer 202 n or a combination thereof) of article200 such at least a portion of one or more layers 202 includesanti-counterfeiting mark microstructure 214 that is different than layermicrostructure 212 of those one or more layers 202. Thus,anti-counterfeiting mark process parameters 162 may be different fromarticle process parameters 156.

For example, anti-counterfeiting mark process parameters 162 may be oneexample of process parameters 112 and may include, but are not limitedto, melting speed 164 of a selected portion of metal powder 116 of oneor more successive powder stratums 104 (e.g., topmost powder stratum 104n, a preceding powder stratum or a combination thereof), power level 166(e.g., energy output) of electromagnetic radiation 106 applied to theselected portion of metal powder 116 of one or more successive powderstratums 104, direction 168 of electromagnetic radiation 106 applied tothe selected portion of metal powder 116 of one or more successivepowder stratums 104, melting temperature 170 of the selected portion ofmetal powder 116 of one or more successive powder stratums 104, holdtemperature 172 of the melted selected portion of metal powder 116 ofone or more successive powder stratums 104, hold time 174 of the meltedselected portion of metal powder 116 of one or more successive powderstratums 104, cool down time 176 to solidify the selected portion ofmetal powder 116 of one or more successive powder stratums 104, scanningspeed 178 of electromagnetic radiation 106 of a selected portion of oneor more successive powder stratums 104 and/or focal offset value 182.

Thus, microstructure 204 of article 200 may include roughly the samegrain orientation and/or physical structure, for example, as seen withmicroscopy. For example, layer microstructure 212 may be repeatedthroughout formation of article 200 (e.g., layer 202 by layer 202) suchthat the grain orientation and/or physical structure of article 200, forexample, as seen with microscopy, are generally the same throughout thethrough-thickness of article 200. Anti-counterfeiting markmicrostructure 214 may include a different (e.g., a variation in) grainorientation and/or physical structure (e.g., defined by purposefulmanipulation of process parameters 112) to achieve a pre-determinedrepresentation such as one of the following marks, but not limited tothese: a shape, a pattern, a textured area, an image, text, numbersand/or code and that is advantageously visible by the eye, microscope orother detection device.

Referring to FIG. 8, article 200 may be additively manufactured toinclude tab 208. Tab 208 may be formed by selectively melting andcooling a portion of a selected powder stratum 104 (e.g., topmost powderstratum 104 n, one or more preceding powder stratums 104 or acombination thereof) (FIG. 1). Thus, tab 208 may be an extension of oneor more layers 202 (e.g., first layer 202 a, topmost layer 202 n, one ormore interior layers 202 c or a combination thereof) of article 200. Asone example, tab 208 may include a thickness equivalent to or greaterthan the thickness of one layer 202 (e.g., the thickness t2 of topmostlayer 202 n).

Anti-counterfeiting mark 206 may be formed in tab 208. Tab 208 mayinclude layer microstructure 212 and anti-counterfeiting mark 206 mayinclude anti-counterfeiting mark microstructure 214 different than layermicrostructure 212 of tab 208. Tab 208 may be easily removed fromarticle 200 once authenticity of article 200 has been established orverified without damaging or otherwise altering the functional use ofarticle 200.

Referring to FIGS. 7 and 8, and with reference to FIG. 1,anti-counterfeiting mark 206 may include any suitable marking that mayverify the authenticity of article 200. For example, anti-counterfeitingmark 206 may include, but is not limited to, an image (e.g., a logo), asymbol, a string of one or more alphabetic characters, a string of oneor more numeric characters, a bar code, a QR code, a combination thereofor any other representative form, for example, that includes brandingelements.

The size (e.g., the two-dimensional surface area) of anti-counterfeitingmark 206 (e.g., on exterior surface 210 or interior of article 200 uponwhich anti-counterfeiting mark 206 is formed) may vary advantageouslyfrom a relatively small size (e.g., in the range of millimeters, micronsor less) to a relatively large size (e.g., in the range of centimeters,inches or more). The size of anti-counterfeiting mark 206 (e.g., fromvery small to very large) may depend on various factors including, butnot limited to, the size and/or function of article 200, the formrepresented by anti-counterfeiting mark 206, the type and/orconfiguration of imaging system 114 used to identify anti-counterfeitingmark 206 during authentication of article and the like.

Because anti-counterfeiting mark 206 is formed by a difference betweenor variation in anti-counterfeiting mark microstructure 214 and layermicrostructure 212 of layer 202 (or article microstructure 204), whenanti-counterfeiting mark 206 is formed proximate the exterior of article200 (e.g., in exterior surface 210 of topmost layer 202 n),anti-counterfeiting mark 206 is not visible to the human eye or undernormal magnification (e.g., less than 25× magnification) from outside ofarticle 200. Similarly, when anti-counterfeiting mark 206 is formed inthe interior of article 200 (e.g., in one or more interior layers 202c), anti-counterfeiting mark 206 is not visible to the human eye orunder normal magnification from outside of article 200. Thus, imagingsystem 114 (FIG. 1) may be utilized to view anti-counterfeiting mark 206and authenticate article 200 as genuine.

Imaging system 114 may include any imaging or scanning system capable ofviewing layer microstructure 212 (or article microstructure 204) andanti-counterfeiting microstructure 214 on a microscopic level (e.g.,greater than 25× magnification) to identify variations there between. Asone example, imaging system 114 may include an imaging or scanningsystem capable of viewing anti-counterfeiting mark 206 (e.g.,inhomogeneity between layer microstructure 212 and anti-counterfeitingmark microstructure 214) on the exterior of article 200. As anotherexample, imaging system 114 may include an imaging or scanning systemcapable of viewing anti-counterfeiting mark 206 (e.g., inhomogeneitybetween layer microstructure 212 and anti-counterfeiting markmicrostructure 214) in the interior of article 200. As a general,non-limiting example, scanner 114 may include any suitable microscopysystem or device. As specific, non-limiting examples, imaging system 114may include, but is not limited to an optical microscopy system, anelectron microscopy system, a scanning probe microscopy system, anultraviolet microscopy system, an infrared microscopy system, a lasermicroscopy system, an x-ray microscopy system or the like.

Referring to FIG. 1, embodiments of apparatus 102 described herein mayinclude computer system 146 and/or computer program product 152 (e.g., asoftware-based tool or application) for implementation of embodiments ofthe additive manufacturing process disclosed herein. Control unit 144may be in communication with computer system 146. Computer system 146and/or computer program product 152 may utilize process data 154 toadditively manufacture article 200.

Computer program product 152 may be implemented by computer system 146.Computer system 146 may include one or more computers 148. When morethan one computer 148 is present in computer system 146, computers 148may be in communication with each other over a communications medium(e.g., using wired and/or wireless communications links or computernetwork).

Process data 154 may include any process information, process controls,process inputs, process factors, base material characteristics and thelike that are utilized to form article 200 by the additive manufacturingprocess. Process data 154 may be stored and/or shared within database150. For example, database 150 may act as a repository for process data154. Computer system 146 may be in communication with database 150 toaccess process data 154.

As general, non-limiting example, process data 154 may include processparameters 112 (e.g., article process parameters 156 and/oranti-counterfeit mark process parameters 162, three-dimensional model158 of article 200 and/or anti-counterfeit image 160 of anti-counterfeitmark 206.

Three-dimensional model 158 may be a 3D CAD image (e.g., a virtualrepresentation) of article 200. As one specific, non-limiting example,three-dimensional model 158 may include a STereoLithography (STL) fileformat. Three-dimensional model 158 may be utilized by computer system146 and/or control unit 144 to form article 200. As one example,three-dimensional model 158 may be generated by a stereolithography CADsoftware application. As another example, three-dimensional model 158may be generated by computer program product 152.

Three-dimensional model 158 may be processed, for example, by computerprogram product 152, to provide instructions to control unit 144regarding the selected portion of metal powder 116 of each powderstratum 104 to selectively irradiate (e.g., melt) with electromagneticradiation 106. As one example, three-dimensional model 158 may be slicedinto a plurality of cross-sections (e.g., cross-sectional slices 180)representing each layer 202 of article 200.

Anti-counterfeit image 160 may be a 3D CAD image (e.g., a virtualrepresentation) of anti-counterfeit mark 206. As one specific,non-limiting example, anti-counterfeit image 160 may include aSTereoLithography (STL) file format. Anti-counterfeit image 160 may beutilized by computer system 146 and/or control unit 144 to formanti-counterfeit mark 206 in one or more layers 202 of article 200. Asone example, anti-counterfeit image 160 may be generated by astereolithography CAD software application. As another example,anti-counterfeit image 160 may be generated by computer program product152.

Anti-counterfeit image 160 may be processed, for example, by computerprogram product 152, to provide instructions to control unit 144regarding the selected portion of metal powder 116 of one or more powderstratums 104 to selectively irradiate (e.g., melt) with electromagneticradiation 106.

The illustrated embodiment of additive manufacturing environment 100 inFIG. 1 is not meant to provide physical or architectural limitations tothe manner in which different embodiments may be implemented. Othercomponents in addition to and/or in place of the ones illustrated may beused. Some components may be unnecessary in some example embodiments.Also, the blocks are presented to illustrate some functional components.One or more of these blocks may be combined and/or divided intodifferent blocks when implemented in different embodiments.

Referring to FIGS. 9A and 9B, and with reference to FIG. 1, oneembodiment of the disclosed method, generally designated 300, formanufacturing a three-dimensional article with anti-counterfeiting markmay begin with the step of generating three-dimensional model 158representing article 200, as shown at block 302. As shown at block 310,method 300 may further include the step of generating a representationof anti-counterfeiting mark 206. As one example, the representation ofanti-counterfeiting mark 206 may include anti-counterfeiting image 160.

As shown at block 342, method 300 may further include the step ofprocessing or merging the representation of anti-counterfeiting mark 206(e.g., anti-counterfeiting image 160) and three-dimensional model 158,for example, by computer program product 152, such thatthree-dimensional model 158 represents both article 200 andanti-counterfeit mark 206 (e.g., model with representation ofanti-counterfeit image 160 integrated or included within representationof article 200).

As shown at block 304, method 300 may further include the step ofgenerating cross-sectional slices 180 of three-dimensional model 158, asshown at block 304. Thus, one or more cross-sectional slices 180corresponding to one or more layers 202 may include at least a portionof the representation of the anti-counterfeiting mark 206 (e.g.,anti-counterfeit image 160). For example, cross-sectional slice 180 mayrepresent at least one layer 202 and at least a portion ofanti-counterfeiting mark 206.

As shown at block 344, method 300 may further include the step ofproviding three-dimensional model 158 with the representation ofanti-counterfeiting mark 206 (e.g., anti-counterfeiting image 160) toadditive manufacturing apparatus 102 (e.g., from computer system 146 tocontrol unit 144). For example, a plurality of cross-sectional slices180 corresponding to or representing one or more layers 202 andanti-counterfeiting mark 206 may be provided to additive manufacturingapparatus 102.

As shown at block 306, method 300 may further include the step ofgenerating process parameters 112 (e.g., article process parameters 156)for the additive manufacturing process to establish articlemicrostructure 204 of article 200 (or layer microstructure 212 of one ormore layers 202).

As shown at block 308, method 300 may further include the step ofproviding process parameters 112 (e.g., one or more article processparameters 156) to additive manufacturing apparatus 102 (e.g., fromcomputer system 146 to control unit 144).

As shown at block 312, method 300 may further include the step ofgenerating process parameters 112 (e.g., anti-counterfeiting markprocess parameters 162) for the additive manufacturing process toestablish anti-counterfeiting mark microstructure 214 ofanti-counterfeiting mark 206.

As shown at block 314, method 300 may further include the step ofproviding varied or manipulated process parameters 112 (e.g.,anti-counterfeiting mark process parameters 162) to additivemanufacturing apparatus 102 (e.g., from computer system 146 to controlunit 144).

As shown at block 316, method 300 may further include the step ofsuccessively building up article 200 from metal powder 116 by theadditive manufacturing process by scanning a selected portion of metalpowder 116 with electromagnetic radiation 106.

As shown at block 318, method 300 may further include the step forminganti-counterfeiting mark 206 in article 200 during the additivemanufacturing process (e.g., in situ).

As used herein, “scanning” generally refers to the irradiating orotherwise subjecting the selected portion of metal powder 116 (e.g., ofpowder stratum 104) with electromagnetic radiation 106. The selectedportion of metal powder 116 scanned by electromagnetic radiation 106 toform each layer 202 of article 200 may correspond to a cross-section ofarticle 200 according to cross-sectional slices 180 of three-dimensionalmodel 158. The selected portion of metal powder 116 scanned byelectromagnetic radiation 106 to form anti-counterfeiting mark 206 ofarticle 200 may correspond to a portion of the cross-section of article200 according to cross-sectional slices 180 of three-dimensional model158 including anti-counterfeiting image 160.

As shown at block 320, the step of building up article 200 (block 316)may include the step of depositing powder stratum 104 onto buildplatform 130.

As shown at block 322, the step of building up article 200 (block 316)may further include melting a selected portion of powder stratum 104with electromagnetic radiation 106.

As shown at block 324, the step of building up article 200 (block 316)may further include depositing subsequent powder stratums 104 upon eachprior powder stratum 104.

As shown at block 326, the step of building up article 200 (block 316)may further include melting a selected portion of each subsequent powderstratum 104 with electromagnetic radiation 106.

As shown at block 328, the step of building up article 200 (block 316)may further include solidifying (e.g., cooling or curing) the selectedportion of powder stratum 104 and the selected portion of eachsubsequent powder stratum 104 to form article 200 includinganti-counterfeiting mark 206.

As one example implementation, the step of building up article 200(block 316) may include depositing first powder stratum 104 a onto buildplatform 130. A selected portion of metal powder 116 of first powderstratum 104 a (e.g., corresponding to cross-sectional slice 180representing first layer 202 a) may be melted with electromagneticradiation 106 to form first layer 202. Second powder stratum 104 b maybe deposited upon first layer 202 a and first powder stratum 104 a. Aselected portion of metal powder 116 of second powder stratum 104 b(e.g., corresponding to cross-sectional slice 180 representing secondlayer 202 b) may be melted with electromagnetic radiation to form secondlayer 202 b. Any number of additional interior powder stratums 104 maybe deposited upon immediately previous powder stratums 104, for example,until reaching the last cross-sectional slice 180 according tothree-dimensional model 158. Topmost powder stratum 104 n (e.g.,corresponding to cross-sectional slice 180 representing topmost layer202 n) may be deposited upon an immediately previous interior layer 202c and powder stratums 104. A selected portion of metal powder 116 oftopmost powder stratum 104 n (e.g., corresponding to cross-sectionalslice 180 representing topmost layer 202 n) may be melted withelectromagnetic radiation 106 to form topmost layer 202 n. The selectedportion of metal powder 116 of first powder stratum 104 a, second powderstratum 104 b, any additional interior powder stratums 104 and topmostpowder stratum 104 n may be solidified so that first layer 202 a, secondlayer 202 b, any additional interior layers 202 c and topmost layer 202n bond together.

As shown at block 330, the step of forming anti-counterfeiting mark 206(block 318) may include the step of melting a selected portion of atleast one powder stratum 104 of subsequent powder stratums 104 withelectromagnetic radiation 106.

As shown at block 332, the step of forming anti-counterfeiting mark 206(block 318) may further include solidifying the selected portion of atleast one powder stratum 104 of subsequent powder stratums 104 to formanti-counterfeiting mark 206 in article 200.

As one example implementation, the step of forming anti-counterfeitingmark 206 (block 318) may include the step of melting a selected portionof metal powder 116 of topmost powder stratum 104 n (e.g., correspondingto cross-sectional slice 180 representing topmost layer 202 n withanti-counterfeiting image 160) to form anti-counterfeiting mark 206 intopmost layer 202 n of article 200. As another example implementation,the step of forming anti-counterfeiting mark 206 (block 318) may includethe step of melting a selected portion of metal powder 116 of at leastone interior powder stratum 104 (e.g., corresponding to cross-sectionalslice 180 representing at least one interior layer 202 c withanti-counterfeiting image 160) to form anti-counterfeiting mark 206 inat least one interior layer 202 c of article 200.

Those skilled in the art will appreciate that the step of building uparticle 200 (block 316) and the step of forming anti-counterfeiting mark206 (block 318) may occur substantially concurrently. For example, thesteps of melting and solidifying the selected portions of at least onepowder stratum 104 of subsequent powder stratums 104 to form at leastone layer 202 (e.g., at least one interior layer 202 c, topmost layer202 n or a combination thereof) and anti-counterfeiting mark 206 in theat least one layer 202 may occur concurrently during the additivemanufacturing process for the corresponding layer 202.

As shown at block 334, method 300 may further include the step ofestablishing article microstructure 204 of article 200 (or layermicrostructure 212 of each layer 202.

As shown at block 336, method 300 may further include the step ofestablishing anti-counterfeiting mark microstructure 214 ofanti-counterfeiting mark 206. Anti-counterfeiting mark microstructure214 may be different than or be a variation in article microstructure204 (or layer microstructure 212 of one or more layers 202).

As shown at block 338, the step of establishing article microstructure204 of article 200 (or layer microstructure 212 of each layer 202)(block 334) may include the step of setting one or more processparameters 112 (e.g., article process parameters 156) of the additivemanufacturing process to generate or form article 200 having apredetermined article microstructure 204 (or layers 202 each having apredetermined layer microstructure 212).

As shown at block 340, the step of establishing anti-counterfeiting markmicrostructure 214 of anti-counterfeiting mark 206 may include the stepof manipulating one or more process parameters 112 (e.g., settinganti-counterfeiting mark process parameters 162) of the additivemanufacturing process to generate or form anti-counterfeiting mark 206in at least one layer 202 having a predetermined anti-counterfeitingmark microstructure 214.

As shown at block 346, method 300 may further include the step ofdetermining whether article 200 includes anti-counterfeiting mark 206 inat least one layer 202 during the additive manufacturing process.

As shown at block 348, the step of determining whether article 200includes anti-counterfeiting mark 206 (block 346) may include the stepof examining or inspecting article 200 on a microscopic level, forexample, using imaging system 114. As one example, following formationof at least one layer 202 of article 200 and anti-counterfeiting mark206 in that layer 202, imaging system 114 may be used to visuallyinspect article 200 (e.g., the formed layer 202) in order to verify thatanti-counterfeiting mark 206 was appropriately formed in thecorresponding layer 202. As another example, following formation ofarticle 200 (e.g., after formation of topmost layer 202 n) andanti-counterfeiting mark 206 in at least one layer 202 (e.g., one ormore interior layers 202 c, topmost layer 202 n or a combinationthereof), imaging system 114 may be used to visually inspect article 200in order to verify that anti-counterfeiting mark 206 was appropriatelyformed in the corresponding layer 202 within article.

Examination of article 200, for example, with imaging system 114, mayidentify any variations in anti-counterfeiting microstructure 214 andarticle microstructure 204 (or any layer microstructure 212).

Anti-counterfeiting mark microstructure 214 may include amicroscopically perceptible variation compared to article microstructure204 (or layer microstructure 212 of at least one layer 202), which maybe used to authenticate article 200. As one example, anti-counterfeitingmark 206 may include at least one branding element (e.g., defined byanti-counterfeiting image 160) for authenticating article 200.

Modifications, additions, or omissions may be made to method 300 withoutdeparting from the scope of the present disclosure. Method 300 mayinclude more, fewer, or other steps. Additionally, steps may beperformed in any suitable order.

FIG. 10 illustrates one embodiment of data processing system 600. Dataprocessing system 600 may be an example of a data processing system usedto perform functions provided by computers 148 of computer system 146(FIG. 1). Data processing system 600 may include communications bus 602,which provides communications between processor unit 604, memory 606,persistent storage 608, communications unit 610, input/output (“I/O”)unit 612, and display 614.

Communications bus 602 may include one or more buses, such as a systembus or an input/output bus. Communications bus 602 may be implementedusing any suitable type of architecture that provides for a transfer ofdata between different components or devices attached to the bus system.

Processor unit 604 may serve to execute instructions for software thatmay be loaded into memory 606. Processor unit 604 may be one or moreprocessors or may be a multi-processor core, depending on the particularimplementation. As one example, processor unit 604 may be implementedusing one or more heterogeneous processor systems, in which a mainprocessor is present with secondary processors on a single chip. Asanother example, processor unit 604 may be a symmetric multi-processorsystem containing multiple processors of the same type.

Memory 606 and persistent storage 608 may be examples of storage devices616. Storage device 616 may be any piece of hardware that is capable ofstoring information including, but not limited to, data, program code infunctional form, and/or other suitable information either on a temporarybasis and/or a permanent basis. For example, memory 606 may be a randomaccess memory or any other suitable volatile or non-volatile storagedevice.

Persistent storage 608 may take various forms, depending on theparticular implementation. Persistent storage 608 may contain one ormore components or devices. For example, persistent storage 608 may be ahard drive, a flash memory, a rewritable optical disk, a rewritablemagnetic tape, or some combination thereof. The media used by persistentstorage 608 may be removable. For example, a removable hard drive may beused for persistent storage 608.

Communications unit 610 may provide for communication with other dataprocessing systems or devices. As one example, communications unit 610may include a network interface card. As another example, communicationsunit 610 may include one or more devices used to transmit and receivedata, such as a modem or a network adapter. Communications unit 610 mayprovide communications through the use of wired and/or wirelesscommunications links.

Input/output unit 612 may allow for the input and output of data withother devices connected to data processing system 600. For example,input/output unit 612 may provide a connection for input through akeyboard, a mouse, and/or some other suitable input device. Further,input/output unit 612 may send output to a printer and/or display 614.Display 614 may provide a mechanism to display information.

Instructions for the operating system, applications, and/or programs maybe located in storage devices 616, which are in communication withprocessor unit 604 through communications bus 602. As one example, theinstructions are in a functional form on persistent storage 608. Theinstructions may be loaded into memory 606 for execution by processorunit 604. The processes of the different embodiments may be performed byprocessor unit 604 using computer implemented instructions, which may belocated in a memory, such as memory 606.

The instructions may be referred to as program code, computer usableprogram code, or computer readable program code that may be read andexecuted by a processor in processor unit 604. The program code, in thedifferent embodiments, may be embodied on different physical or computerreadable storage media, such as memory 606 or persistent storage 608.

Program code 618 may be located in a functional form on the computerreadable media 620 that is selectively removable and may be loaded ontoor transferred to data processing system 600 for execution by processorunit 604. Program code 618 and computer readable media 620 may formcomputer program product 152. In one example, computer readable media620 may be computer readable storage media 624 or computer readablesignal media 626.

Computer readable storage media 624 may include, but is not limited to,an optical or magnetic disk that is inserted or placed into a drive orother device that is part of persistent storage 608 for transfer onto astorage device, such as a hard drive, that is part of persistent storage608. Computer readable storage media 624 also may take the form of apersistent storage, such as a hard drive, a thumb drive, or a flashmemory that is connected to data processing system 600. In someinstances, computer readable storage media 624 may not be removable fromdata processing system 600.

Alternatively, program code 618 may be transferred to data processingsystem 600 using computer readable signal media 626. For example,computer readable signal media 626 may be a propagated data signalcontaining program code 618. Computer readable signal media 626 mayinclude, but is not limited to, an electromagnetic signal, an opticalsignal, and/or any other suitable type of signal. These signals may betransmitted over communications links, such as wireless communicationslinks, a wire, an optical fiber cable, a coaxial cable, and/or any othersuitable type of communications link.

In one example embodiment, program code 618 may be downloaded (e.g.,over a network) to persistent storage 608 from another device or dataprocessing system through computer readable signal media 626 for usewithin data processing system 600. For example, program code stored incomputer readable storage media in a server data processing system maybe downloaded over a network from the server to data processing system600. The data processing system providing program code 618 may be aserver computer, a client computer, or some other device capable ofstoring and transmitting program code 618.

The illustrated embodiment of data processing system 600 in FIG. 11 isnot meant to provide physical or architectural limitations to the mannerin which different embodiments may be implemented. Other components inaddition to and/or in place of the ones illustrated may be used. Somecomponents may be unnecessary in some example embodiments. Also, theblocks are presented to illustrate some functional components. One ormore of these blocks may be combined and/or divided into differentblocks when implemented in different example embodiments.

Examples of the present disclosure may be described in the context ofaircraft manufacturing and service method 1100 as shown in FIG. 11 andaircraft 1200 as shown in FIG. 12. During pre-production, theillustrative method 1100 may include specification and design, as shownat block 1102, of aircraft 1200 and material procurement, as shown atblock 1104. During production, component and subassembly manufacturing,as shown at block 1106, and system integration, as shown at block 1108,of aircraft 1200 may take place. Thereafter, aircraft 1200 may gothrough certification and delivery, as shown block 1110, to be placed inservice, as shown at block 1112. While in service, aircraft 1200 may bescheduled for routine maintenance and service, as shown at block 1114.Routine maintenance and service may include modification,reconfiguration, refurbishment, etc. of one or more systems of aircraft1200.

Each of the processes of illustrative method 1100 may be performed orcarried out by a system integrator, a third party, and/or an operator(e.g., a customer). For the purposes of this description, a systemintegrator may include, without limitation, any number of aircraftmanufacturers and major-system subcontractors; a third party mayinclude, without limitation, any number of vendors, subcontractors, andsuppliers; and an operator may be an airline, leasing company, militaryentity, service organization, and so on.

As shown in FIG. 12, aircraft 1200 produced by illustrative method 1100may include airframe 1202 with a plurality of high-level systems 1204and interior 1206. Examples of high-level systems 1204 include one ormore of propulsion system 1208, electrical system 1210, hydraulic system1212 and environmental system 1214. Any number of other systems may beincluded. Although an aerospace example is shown, the principlesdisclosed herein may be applied to other industries, such as theautomotive and marine industries.

The apparatus and methods shown or described herein may be employedduring any one or more of the stages of the manufacturing and servicemethod 1100. For example, components or subassemblies corresponding tocomponent and subassembly manufacturing (block 1106) may be fabricatedor manufactured in a manner similar to components or subassembliesproduced while aircraft 1200 is in service (block 1112). Also, one ormore examples of the apparatus and methods, or combination thereof maybe utilized during production stages (blocks 1108 and 1110), forexample, by substantially reducing the risks associated with counterfeitcomponents in aircraft manufacturing and service processes. Similarly,one or more examples of the apparatus and methods, or a combinationthereof, may be utilized, for example and without limitation, whileaircraft 1200 is in service (block 1112) and during maintenance andservice stage (block 1114).

Although various embodiments of the disclosed apparatus and methods havebeen shown and described, modifications may occur to those skilled inthe art upon reading the specification. The present application includessuch modifications and is limited only by the scope of the claims.

What is claimed is:
 1. An additively manufactured three-dimensionalarticle comprising: an article body comprising layers successively builtup from a metal powder using an additive manufacturing process byscanning a first portion of said metal powder with electromagneticradiation, wherein each one of said layers comprises a layermicrostructure established by a first melting profile of said firstportion of said metal powder; and an anti-counterfeiting mark formed inat least one of said layers during said additive manufacturing processby scanning a second portion of said metal powder with saidelectromagnetic radiation, wherein said anti-counterfeiting markcomprises an anti-counterfeiting mark microstructure established by asecond melting profile of said second portion of said metal powder,wherein said anti-counterfeiting mark microstructure is different thansaid layer microstructure.
 2. The article of claim 1 wherein said atleast one of said layers is a topmost layer of said layers.
 3. Thearticle of claim 1 wherein said anti-counterfeiting mark microstructurecomprises a microscopically perceptible variation compared to said layermicrostructure.
 4. The article of claim 3 wherein saidanti-counterfeiting mark is only visible under at least a 25×magnification.
 5. The article of claim 1 wherein saidanti-counterfeiting mark comprises at least one of an image, a symbol, astring of one or more alphabetic characters, a string of one or morenumeric characters, and a bar code.
 6. The article of claim 1 whereinsaid anti-counterfeiting mark comprises at least one branding elementfor authenticating said article.
 7. The article of claim 1 wherein saidanti-counterfeiting mark extends through at least a portion of athickness of said at least one of said layers.
 8. The article of claim 1wherein said anti-counterfeiting mark comprises a thickness of at least0.010 inch.
 9. The article of claim 1 wherein: said first meltingprofile of said first portion of said metal powder is selectivelycontrolled by at least one process parameter of said additivemanufacturing process; and said second melting profile of said secondportion of said metal powder is selectively controlled by a modificationof said at least process parameter of said additive manufacturingprocess.
 10. The article of claim 9 wherein said at least one processparameter comprises a direction of said electromagnetic radiation. 11.The article of claim 10 wherein said at least one process parameterfurther comprises at least one of a power level of said electromagneticradiation, a scanning velocity of said electromagnetic radiation, and afocal offset value.
 12. The article of claim 1 wherein said at least oneof said layers comprises a tab extending from said article body, andwherein said anti-counterfeiting mark is formed in said tab.
 13. Anadditively manufactured three-dimensional article comprising: an articlebody comprising layers successively built up from a metal powder usingan additive manufacturing process by scanning a first portion of saidmetal powder with electromagnetic radiation; an anti-counterfeiting markformed in at least one of said layers during said additive manufacturingprocess by scanning a second portion of said metal powder with saidelectromagnetic radiation; and wherein: each one of said layerscomprises a layer microstructure established by a first melting profileof said first portion of said metal powder; said anti-counterfeitingmark comprises an anti-counterfeiting mark microstructure established bya second melting profile of said second portion of said metal powder;and said anti-counterfeiting mark microstructure comprises a variationin at least one of grain structure and grain orientation compared tosaid layer microstructure.
 14. The article of claim 13 wherein saidfirst melting profile and said second melting profile are selectivelycontrolled by modifying at least one of a direction of saidelectromagnetic radiation, a melting speed of said metal powder, a powerlevel of said electromagnetic radiation, a melting temperature of saidmetal powder, a hold temperature of said metal powder upon melting, ahold time of said metal powder upon melting, a cool down time tosolidify said metal powder following melting, a scanning velocity ofsaid electromagnetic radiation, and a focal offset value.
 15. Thearticle of claim 13 wherein: said variation in at least one of saidgrain structure and said grain orientation between saidanti-counterfeiting mark microstructure and said layer microstructureextends through at least a portion of a thickness of said article body.16. The article of claim 13 wherein said anti-counterfeiting markcomprises at least one of an image, a symbol, a string of one or morealphabetic characters, a string of one or more numeric characters, a barcode, and a branding element for authenticating said article.
 17. Thearticle of claim 13 wherein: said at least one of said layers comprisesa tab extending from said article body; said anti-counterfeiting mark isformed in said tab; and said tab is removable from the article body. 18.The article of claim 9 wherein said at least one process parametercomprises at least one of a melting speed of said metal powder, amelting temperature of said metal powder, a hold temperature of saidmetal powder upon melting, a hold time of said metal powder uponmelting, and a cool down time to solidify said metal powder followingmelting.
 19. The article of claim 1 wherein: said at least one of saidlayers, in which the anti-counterfeiting mark is formed, comprises aplurality of said layers; and said anti-counterfeiting mark extendsthrough at least a portion of a thickness of said article body.
 20. Thearticle of claim 1 wherein: said layer microstructure comprises a firstgrain structure and a first grain orientation; said anti-counterfeitingmark microstructure comprises a second grain structure and second grainorientation; and at least one of: said first grain structure and saidsecond grain structure are different; and said first grain orientationand said second grain orientation are different.